Taiwanese semiconductor firm Chipbond Technology Corporation inaugurated its new Chipbond Malaysia plant in Penang on Monday. Moreover, the facility represents a NT$6.31 billion ($200 million) investment. It signals Taiwan’s growing influence in Southeast Asia’s semiconductor industry. Officials emphasized that the Chipbond Malaysia plant strengthens bilateral economic and technological ties.
Additionally, Taiwan’s representative to Malaysia, Lien Yu-ping, highlighted the strategic significance of the expansion. She said Taiwan’s advanced semiconductor technologies complement Malaysia’s assembly, testing, and packaging expertise. Furthermore, Lien explained that the collaboration enhances Malaysia’s AI-driven digital transformation amid rising global geopolitical uncertainty.
The opening ceremony also drew attention to the scale of Taiwan-Malaysia cooperation. In 2025, bilateral trade reached NT$1.81 trillion ($57.4 billion). Taiwan ranked as Malaysia’s fourth-largest trading partner. Consequently, Lien stressed that long-term Taiwanese investments have created over 400,000 jobs in Malaysia, showing tangible benefits of cross-border industrial collaboration.
Chipbond’s new facility will focus on display driver integrated circuit packaging and testing. Moreover, analysts suggest the plant could boost Southeast Asia’s semiconductor capacity and support global supply chains. In addition, the expansion reflects Taiwan’s New Southbound semiconductor strategy, which promotes equality, mutual respect, and shared benefit.
Experts further note that Taiwan’s investment aligns with broader regional technology trends. As AI and digital transformation accelerate, Malaysia can leverage Taiwanese expertise to compete globally. Therefore, analysts predict the Chipbond Malaysia plant may inspire similar high-tech partnerships across Southeast Asia.
Political leaders view the expansion as a step toward deeper cooperation. Lien urged updates to bilateral investment protection agreements. She encouraged both governments to strengthen high-tech industry links. Furthermore, the initiative shows Taiwan’s strategic overseas investment approach and supports regional economic resilience.
Looking forward, the Chipbond Malaysia plant could enhance semiconductor production efficiency, increase employment, and accelerate AI-related technological adoption. Officials see the facility as a model for Taiwan’s international industrial strategy, combining private investment with long-term development goals.
Overall, the Chipbond Malaysia plant represents a milestone in Taiwan-Malaysia economic collaboration. It reinforces the importance of cross-border semiconductor cooperation in a rapidly evolving global market.
